Laser diode with simplified adjustment during assembly

摘要

A laser diode which can be easily adjusted during assembly of the diode on a heat sink is mounted over a groove in the heat sink which is free of solder. The groove permits adjustment of a light-transmitting glass fiber relative to the radition-emitting zone of the laser diode. The groove and the laser diode in the form of a chip having a strip-shaped radiation emitting zone are aligned so as to be parallel. Because mechanical connection between the body of the heat sink and the chip exists only outside of the groove, mechanical stresses which would otherwise act upon the radiation-emitting zone are relieved.