发明名称 FLAT PACKAGE
摘要 PURPOSE:To prevent a leak failure due to the bending of leads by a method wherein cutaways are provided near the glass seal for the leads. CONSTITUTION:Between the bottom plate 2 and framework 3 of a package main body 1, a pair of panel-geometry leads 13, 14 are hermetically installed with the intermediary of a glass 4. In the framework 3, a cap 7 is hermetically installed with the intermediary of a low melt point glass 8. In this design, cutaways 15, 16 are formed at the inner root sections of the leads 13, 14. In the presence of the cutaways 15, 16, the glass 4 arranged along the direction of the width of the lead 13, 14 fuses together, providing protrusions 4a of the glass 4. With the package constructed as such, the sealing length of the glass is increased, preventing the leak failure due to the bending of the leads.
申请公布号 JPS61108159(A) 申请公布日期 1986.05.26
申请号 JP19840231654 申请日期 1984.10.31
申请人 NEC KANSAI LTD 发明人 OHIRA RYOZO;MINAMI TERUHIKO
分类号 H03H9/02;H01L23/48;H01L23/495 主分类号 H03H9/02
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