发明名称 PACKAGE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To reduce the loss of light caused by the surface reflection of a package by a method wherein a single layer or multilayer reflection preventing film is provided on one side or both sides of the transparent glass of a package. CONSTITUTION:In the transparent part of a package, a single layer or multilayer reflection preventing film 1 is provided on one side or both sides of the transparent glass 2. MgF2, SiO, ZrO2, CeF3, CeO2 and the like can be used as the material for the reflection preventing film 1. As a result, the optical loss caused by the reflection on the surface of the transparent glass can be sharply improved.
申请公布号 JPS61101051(A) 申请公布日期 1986.05.19
申请号 JP19840223214 申请日期 1984.10.24
申请人 NEC CORP 发明人 SUZUKI TOSHIHIDE
分类号 H01L21/8247;H01L23/02;H01L29/788;H01L29/792 主分类号 H01L21/8247
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