| 摘要 |
PURPOSE:To make a chip small in size by a construction wherein a part of a target for an automatic bonder is provided in extension so that it overlaps with a monitor wiring of an internal circuit so as to make it possible to put the target and the monitor wiring in continuity by the irradiation of laser beam. CONSTITUTION:When a semiconductor chip 1 is completed, a target 6 is found insulated from an electrode pad 5, internal circuits 2, 3 and 4, etc. by an interlayer insulating film 10. In the case when it is necessary to conduct a fault analysis in inspection of the chip and thus to check up an output voltage of any one of the internal circuits 2, 3 and 4, a laser beam X is projected to any one of the widened portions 7, 8 and 9 of a part 6a of the target 6 so as to melt the interlayer insulating film 10 and thereby to put in vertical continu ity the widened portion on the target side and the widened portion 14 of a monitor wiring 11 of the internal circuit 2. Thereby the internal circuit 2 is connected electrically to the target 6, and thus the output voltage of the internal circuit 2 can be led out to the target 6. Accordingly, it is necessary to provide a pad to be used exclusively for monitoring, and an increase in the number of pads can be so curbed as to prevent an increase in the size of the chip and to improve the reliability of wire bonding. |
