| 摘要 |
PURPOSE:To uniform the film thickness distribution by the uniformization of the seat resistance of film, by fixing electrically conductive members to a substrate holder in a manner to be opposed to the edges, parallel to the rotation axis, of a substrate in the device for sputtering by rotation of the substrate. CONSTITUTION:A target 2 is fixed to the inner wall of a vacuum tank 1, and substrate holders 3 each having prismatic sides rotating round the central axis is provided inside the inner wall of the vacuum tank 1; to the each side of the substrate holder is attached a substrate 4. On execution of sputtering in this state, the film thickness of the part, on the surface of the substrate 4, close to the edges parallel to the center of the axis is increased. Consequently, electrically conductive members 5 are fixed to the substrate holder so as to be opposed to the edges, of the substrate 4, parallel to the rotation axis. In this eay, the tendency of increasing the film thickness in the direction of width W is offset by the electrically conductive members 5, and the film thickness distribution uniformized in the direction of width W can be obtained. |
