| 摘要 |
The present invention includes a heat sink device which, in a preferred embodiment, has a number of fins extending from a flat base section. In addition, there are matching grooves formed in a pair of said fins and snapped into said grooves, there is located a plastic clip-on member. The clip-on member is designed to be spread, or temporarily deformed at its ends, in order to be clipped onto a holder which is holding an active element (a heat generating element), such as an integrated circuit. When the clip-on member is so clipped onto the holder, it applies force to hold said flat base section of said heat sink means against the section of the holder which overlies the active element to thereby conduct heat from the active element. The clip-on member can be readily removed if, for instance, the integrated circuit fails and in this way the heat sink is not wasted.
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