| 发明名称 |
Process for producing printed circuit board |
| 摘要 |
A process for producing a printed circuit board characterized by forming a thermosetting resin layer on internal walls of through holes before an electroless plating treatment can produce printed circuit boards having high reliability without causing blow-holes on the through hole walls.
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| 申请公布号 |
US4585502(A) |
申请公布日期 |
1986.04.29 |
| 申请号 |
US19850701533 |
申请日期 |
1985.02.14 |
| 申请人 |
HITACHI CONDENSER CO., LTD. |
发明人 |
UOZU, NOBUO;YOKOYAMA, HIROYOSHI;MATSUDA, YOICHI |
| 分类号 |
H05K3/18;H05K3/38;H05K3/42;(IPC1-7):B32B31/00;B05D5/12;B44C1/22;C23F1/00 |
主分类号 |
H05K3/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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