发明名称 |
Adhesion primers for encapsulating epoxies |
摘要 |
A copper plastic laminate is provided having a high bond strength. The copper is selected from the group consisting of copper and copper alloys and has on its surface a uniform glassy-like, substantially pore-free coating of copper phosphate. A plastic encapsulating material containing a mold release agent is adhesively bonded to the copper.
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申请公布号 |
US4582556(A) |
申请公布日期 |
1986.04.15 |
申请号 |
US19840615605 |
申请日期 |
1984.05.31 |
申请人 |
OLIN CORPORATION |
发明人 |
BUTT, SHELDON H.;SMITH, III, EDWARD F.;GYURINA, F. DENNIS |
分类号 |
H01L23/29;H05K3/38;(IPC1-7):C09J5/00 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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