| 摘要 |
PURPOSE:To enhance the yield of manufacturing a semiconductor device by exposing a resist coated surface of the periphery of a wafer in the step of coating the positive type resist, developing the resist, and then exposing the surface of the periphery, thereby preventing the resist residue from generating. CONSTITUTION:A resist coating unit 5 has a chuck 6 or sucking in vacuum a wafer and rotating it, and a dropping nozzle 7 mounted directly above the chuck 6. In the step of coating a resist, a shielding cover 10 for separating the resist coated surface 8a of the periphery of the wafer from the resist coated surface 8b of the center of the wafer, and a mercury lamp 11a for emitting the coated surface 8a separated by a cover 10 are providing, and the periphery of the wafer is annularly exposed in the prescribed width during coating the resist or after coating the resist by rotating the wafer or rotating at every prescribed angle in the step of coating the resist. Thus, since only the periphery of the wafer is preliminarily exposed, the surface of the periphery of the wafer is exposed after developing the resist. Since a wafer clamp is contacted with the surface, there is no fear of the residue. |
