发明名称 RESIN COMPOSITION FOR ELECTROPHOTOGRAPHY
摘要 PURPOSE:To prevent offset without adding an offset inhibitor and to enable fixing at a lower fixing temp. by blending 80.00-99.95wt% binding resin with 0.05-20.00wt% liq. polybutadiene. CONSTITUTION:A copolymer preferably consisting of 20.00-100.00 parts by weight of styrene and/or a styrene deriv. and 80.00-0 part of at least one kind of (meth)acrylic acid or (meth)acrylic ester is used as a binding resin. This binding resin is combined optionally with other binder and blended with liq. polybutadiene which is a polymer of butadiene showing flowability at >=-10 deg.C to obtain a resin composition for a developer. A copolymer consisting of 70.00-99.95wt% butadiene and 0.05-30.00wt% acrylonitrile is preferably used in place of the liq. polybutadiene. A dry developer composition for electrophotography for heat and pressure fixing consisting essentially of these binding resins and a colorant, can be obtained. Another binder may be jointly used as a main component of the binder to the copolymer of the resin composition for the developing agent, if needed.
申请公布号 JPS6167040(A) 申请公布日期 1986.04.07
申请号 JP19840189246 申请日期 1984.09.10
申请人 KAO CORP 发明人 KAWABE KUNIYASU;TANAKA SHINGO
分类号 C08L25/00;C08L7/00;C08L21/00;C08L25/02;C08L33/00;C08L33/02;C08L33/04;C08L33/06;G03G9/08;G03G9/087 主分类号 C08L25/00
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