发明名称 |
RESIN COMPOSITION FOR ELECTROPHOTOGRAPHY |
摘要 |
PURPOSE:To prevent offset without adding an offset inhibitor and to enable fixing at a lower fixing temp. by blending 80.00-99.95wt% binding resin with 0.05-20.00wt% liq. polybutadiene. CONSTITUTION:A copolymer preferably consisting of 20.00-100.00 parts by weight of styrene and/or a styrene deriv. and 80.00-0 part of at least one kind of (meth)acrylic acid or (meth)acrylic ester is used as a binding resin. This binding resin is combined optionally with other binder and blended with liq. polybutadiene which is a polymer of butadiene showing flowability at >=-10 deg.C to obtain a resin composition for a developer. A copolymer consisting of 70.00-99.95wt% butadiene and 0.05-30.00wt% acrylonitrile is preferably used in place of the liq. polybutadiene. A dry developer composition for electrophotography for heat and pressure fixing consisting essentially of these binding resins and a colorant, can be obtained. Another binder may be jointly used as a main component of the binder to the copolymer of the resin composition for the developing agent, if needed. |
申请公布号 |
JPS6167040(A) |
申请公布日期 |
1986.04.07 |
申请号 |
JP19840189246 |
申请日期 |
1984.09.10 |
申请人 |
KAO CORP |
发明人 |
KAWABE KUNIYASU;TANAKA SHINGO |
分类号 |
C08L25/00;C08L7/00;C08L21/00;C08L25/02;C08L33/00;C08L33/02;C08L33/04;C08L33/06;G03G9/08;G03G9/087 |
主分类号 |
C08L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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