| 摘要 |
PURPOSE:To detect the condition of bump connection and to improve the reliabil ity thereof, by press-hitting a plurality of monitoring bumps on the periphery of a semiconductor chip, and providing reference rings around them for compar ing the size thereof with the diameter of the monitoring bumps which is in creased by the contact bonding. CONSTITUTION:In order to fay down a chip 1 to a chip 3, they are aligned with monitoring beams 7. The monitoring bumps, which are deformed by the contact bonding to increase their diameter, are observed with infrared rays such that the changing diameter can be constantly compared with the size of reference size rings 9. When the bumps are loaded, the monitoring bumps which are interposed between the chips 1 and 3 are deformed progressively, increasing their diameter. When the diameter is finally increased up to a size corresponding to that of the reference ring, it is determined that all the bumps on the chip have been connected properly. |
