| 摘要 |
PURPOSE:To lessen adverse effects of the electrode-earth source inductance of the titled element and its parasitic capacitance on high frequency characteristics, and further to enhance the effect of dissipating heat generating in the operating layer, by a method wherein the PSB structure and the via-hole structure are both used in this element. CONSTITUTION:Prescribed voltages are impressed each on source 2, gate 3, and drain 4 electrodes formed on said element 1. A parasitic capacitance 7 generates between the source electrode 2 and the earth 10, but the parasitic capacitance value reduce because of via-hole 41 structure. At the point of voltage impressing, heat generates in an operating layer 6 and passes through the element thermal resistor 9 of this element 1. At that time, however, the material beginning to leak out of a PSB plating metal 5 is inserted into a via-hole 41, and so the heat of the operating layer 6 is transmitted toward via-holes of smaller thermal resistance, leading to the improvement of heat dissipating effect as the high-frequency element 1. |
