| 摘要 |
Assembly of certain semiconductor components onto a suitable carrier plate, for example glass. The carrier disc is provided with a thin glass layer onto which the component is laid with its connection side. The parts to be connected are heated, between two mutually electrically insulated metal discs, to a temperature not exceeding the glass-soldering temperature. In the process, a direct voltage is applied to the two mutually insulated metal discs in such a way, that the anode is located on the component side and the cathode is located at the glazed carrier disc. |
