发明名称 SOLDERING METHOD AND ITS DEVICE
摘要 PURPOSE:To improve the efficiency of soldering by installing a jig to a holding body so as to be turnable, and also soldering successively a part to be soldered by one surface each, through a movement of the holding body and turning of the jig. CONSTITUTION:A holding body 14 provided with a turnable jig 41 rotates intermittently by a prescribed angle each an horizontal plane together with a turntable 13. A jet type flux applying device, a preheating device, a solder tank for moving up and down, a cleaning device, and a cold air and hot air drying device are provided successively on the lower position of a moving part of the holding body 14. Many objects to be soldered provided in parallel on supporting rods 43, 43a of the jig 41 are brought to preheating, application of a flux, soldering, and drying successively by a rotation of the turntable 13, and also each surface of the object to be soldered is soldered through a rotation of a shaft 28 of the jig 41. In this way, the soldering work is automated, and the soldering efficiency is improved.
申请公布号 JPS6163357(A) 申请公布日期 1986.04.01
申请号 JP19840185236 申请日期 1984.09.04
申请人 TAMURA SEISAKUSHO CO LTD 发明人 MASUDA TSUGUNORI
分类号 B23K1/08;B23K3/00;H01L23/50 主分类号 B23K1/08
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