| 摘要 |
Encapsulation of electronic components. Method of encapsulating bare electronic components 11 coming in the form of a continuous strip 12 and intended to be provided with casings 13, 14 of defined shape, produced from at least one plastic 15, characterised in that, by extrusion with the aid of an extruder head 16 the profile desired for the said casings 13, 14 is imparted to the plastic 15, whilst the bare electronic components are continuously inserted and immobilised in the said profile, and in that, in a final operation, common slices of extruded plastic 15 and of component strip 12 are sectioned so as to separate the bare electronic components 11 thereby provided with their casings 13, 14. Application to the manufacture of indicator lights. <IMAGE> |
