| 摘要 |
An insulated metal substrate with an organic layered electric circuit made of conductive foil material can be used for a large variety of cost-effective applications for power distribution boards. The layered component comprises an aluminium substrate on which a three-layered insulating material for connecting the electric circuit made of conductive foil with the metal substrate underneath it is arranged. The multi-layered insulating material comprises two layers of a thermosetting pressure-sensitive adhesive film, between which a very puncture-resistant insulating layer is disposed which is formed either by a polyimide film or a polyetherimide film. The multi-layered insulating material is first, while supplying heat, made to adhere to the metal substrate, and the conductive foil material, in the form of a continuous web or a punched circuit, is applied to the multi-layered insulating material in a coating press prior to arranging the module. The metal foil material is coated onto the metal substrate underneath it, the edges of the foil material remaining electrically insulated with respect to the metal substrate, and a continuous path of conductive metal foil material is etched so as to form the electric circuit from the conductive foil. Prior to application to the metal substrate, holes may be punched into the multi-layered insulating material, so that the conductive foil covering the holes is ... with the ... Original abstract incomplete.
|
