发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE
摘要 PURPOSE:To realize low temperature heat processing and improve reliability of product through selective local heating of film by irradiation of light having particular wavelength which is selectively absorbed for coupling of film forming material. CONSTITUTION:As an insulation film, surface protection film of a semiconductor device, for example, a phosphor added silicon oxide film (hereinafter referred to as PSG film) is formed. Next, an energy is selectively absorbed in the surrounding of the P-O coupling with disassembling and recoupling of P-O coupling when the PSG film is irradiated with the light of the wavelength having the energy which is equal to the coupling energy of P-O coupling. Therefore, energy absorption occurs at the surface PSG film and only the surface layer is locally heated, resulting in the effect similar to the high temperature processing as the surface. According to this method, low temperature heat processing is realized and reliability of product can also be enhanced.
申请公布号 JPS6159737(A) 申请公布日期 1986.03.27
申请号 JP19840180952 申请日期 1984.08.30
申请人 NEC CORP 发明人 SATOU KUNIYA
分类号 H01L21/31;H01L21/20;H01L21/324 主分类号 H01L21/31
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