| 摘要 |
<p>Electromagnetic radiation of 10<-3> to 10<-9>m. wavelength in the form of a plurality of simultaneously operative beams is used for soldering. As described a laser soldering apparatus is used to reflow soldering chip component 16 (e.g. capacitor) to a circuit module 32. A laser beam 6 is directed at a slotted plate 8 to provide two beams 2,4 which are sent on diverging and then converging paths by mirrors 14, 22, 24 to melt solder at the two ends of the chip component simultaneously. The module may be supported on an X-Y plotter table (e.g. controlled by a microprocessor) for positioning of components, and the position of mirror 24 may be adjusted to suit component size. The laser is preferably a pulsed 1.06 mu m laser with control over pulse width and repetition rate and length of pulse burst. <IMAGE></p> |
