| 摘要 |
PURPOSE:To improve the brazing strength by a method wherein, when a metalized layer connecting an element to outer electric circuit is provided on the periphery of an insulating vessel containing a semiconductor element and a part of base plane, a thin layer such as Pt, Pd etc. is laminated on the surface of metalized layer. CONSTITUTION:An insulating substrate 1 and another substrate 2 are made of electric insulating material such as ceramics and glass etc. while a cavity is formed on the surface central part of substrate 1 to bond an IC element 5 thereto. Next the electrodes provided on the element 5 are connected to metalized layer 3 such as W1, Mo located on the surface, sides and part of base. Later overall surface layer 3 is coated with a layer 4 such as Pt, Pd etc. 0.3-3.0mum thick to connect the part of layer 3 on the base edge to a wire conductor 8 on outer electric wiring substrate 7 using a solder 9. Through these procedures, the soldered may be prevented from rusting and peeling off. |
