发明名称 EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE OF RESIN SEALED TYPE USING SAME
摘要 PURPOSE:The titled composition providing a cured material having improved heat-resistant cycle characteristics, obtained by blending a resin composition comprising an epoxy resin and a curing agent with an organic phosphine compound, antimony tetroxide, etc., in a specific ratio. CONSTITUTION:(A) 90-30pts.wt. epoxy resin (novolak type epoxy resin having preferably 170-300 epoxy equivalent) is blended with (B) 10-70pts.wt. curing agent containing >=2 phenolic hydroxyl groups (preferably novolak type phenolic resin, etc.), (C) 0.01-20pts.wt. organic phosphine compound (preferably aryl phosphine compound), (D) 0.1-30pts.wt. one or more of diantimony tetroxide, Sb6O13, and diantimony pentoxide, and, if necessary, (E) a halogen compound (e.g., brominated epoxy resin, etc.), (F) an inorganic filler (e.g., molten silica, etc.), to give the aimed composition.
申请公布号 JPS6153321(A) 申请公布日期 1986.03.17
申请号 JP19840174148 申请日期 1984.08.23
申请人 TOSHIBA CORP 发明人 IKETANI HIROTOSHI;AZUMA MICHIYA
分类号 C08G59/00;C08G59/40;C08G59/62;C08G59/68;C08L63/00;H01L23/29;H01L23/31 主分类号 C08G59/00
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