BOITIER POUR COMPOSANT ELECTRONIQUE COMPORTANT UN ELEMENT FIXANT L'HUMIDITE

摘要

A hermetically sealed encapsulation package for electronic components and integrated or hybrid electronic circuits has a base on which the component or circuit is mounted in the conventional manner and a cover. In one embodiment, the base includes a layer of a material which is able to retain any water molecules which might remain within the package after sealing or which may result from in-leakage from the surrounding atmosphere.