| 摘要 |
PURPOSE:To obtain a stamper for a Fresnel microlens with high accuracy, by repeating a process wherein an annular band pattern is transferred to the resist layer applied to a substrate before the substrate is etched selectively. CONSTITUTION:Resist 16 is applied to a Si-wafer substrate provided with an oxide film 23 (stage A) and a first annular band pattern is transferred to the resist layer 16 and electron beam is allowed to irradiate a part 17 through said pattern (stage B). After the resist layer 16 is developed, the resist 16 is used as a mask to etch the film 23 (stage C) and, subsequently, the resist 16 is removed and the resist 16 is again applied to the entire surface of the film 23 (stage D). Electron beam is allowed to irradiate a part 18 through a second annular band pattern (stage E) and, after the resist 6 is removed, said part 18 is etched (stage F). These stages are repeated (stage G) to obtain a stamper having a shape near to an ideal saw-toothed cross-sectional area 19. This stamper is used as a mold to mold a resin 20 and a Fresnel microlens is obtained. |
