| 摘要 |
PURPOSE:To improve yield by dividing LSI into two portions of a high voltage resistance chip and an ordinary chip. CONSTITUTION:A high voltage resistance chip 1 is loaded on a package 10, an ordinary chip 6 is loaded thereon on the phase-up basis, and both chips 1, 6 are connected with pads 5, 8. The pads 4 in the periphery of chip 1 and interval leads 11 metallized to the package 10 are bonded by wires 13. The internal lead 11 is connected to external lead 12 of package. A low voltage regulator circuit is formed on the chip 1 and it is used as the power source of chip 6. |
