RESIN SEALED TYPE SEMICONDUCTOR DEVICE

摘要

PURPOSE:To improve dielectric strength and heat dissipating capacity while preventing foaming phenomenon from happening during resin forming process by a method wherein an opposing side main surface of a radiating plate is carved into multiple grooves specifying the direction of resin molding operation. CONSTITUTION:A semiconductor element 101 is mounted on the surface of a chip head 116 formed of copper material patterned by etching process etc. using solder with high melting point. A main surface 1a of an aluminium made heat dissipating plate 1 arranged on a main surface opposite to the mount surface of semiconductor element of chip head 116 opposing thereto at specified space is carved into multiple grooves 2 in a specified direction. Finally the heat dissipating plate 1 excluding the non-opposing main surface is molded with thermoconductive resin.