发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:A thermosetting resin composition which can give a cured film excellent in physical, chemical and electrical properties and is useful for a variety of applications, prepared by emulsifying an epoxy resin by using a specified water- soluble polyester resin as a curing/surface active agent. CONSTITUTION:The desired thermosetting resin composition is obtained by emulsifying an epoxy resin by using a water-soluble polyester resin of an acid value of 20-100 as a curing/surface active agent. In the production of the above water-soluble polyester resin, it is desirable to use 1-40mol%, based on the acid component, at least tribasic carboxylic acid. An example of the tribasic acid is hemimellitic acid. It is preferable that said water-soluble polyester resin comprises a reaction component containing 1-40mol%, based on the acid component, at least tribasic carboxylic acid and at most 20mol% sulfate of a diol or of a carboxylic acid.
申请公布号 JPS6137811(A) 申请公布日期 1986.02.22
申请号 JP19840161198 申请日期 1984.07.30
申请人 GOOU KAGAKU KOGYO KK 发明人 WAKABAYASHI TOSHIHIRO;FUKUSHIMA YASUHITO;YANAI KIYOSHI
分类号 C08L67/00;C08G59/00;C08G59/40;C08G63/00;C08G63/12;C08G63/68;C08L63/00;C09D163/00;C09D167/00;C09J163/00;D06M15/507;D06M15/55 主分类号 C08L67/00
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