首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
摘要
申请公布号
DE3301870(C2)
申请公布日期
1986.02.20
申请号
DE19833301870
申请日期
1983.01.21
申请人
BAYER AG, 5090 LEVERKUSEN, DE
发明人
KOLL, JOCHEN, 5068 ODENTHAL, DE;MOELLS, HANS-HEINZ, DR., 5090 LEVERKUSEN, DE;DITZER, REINER, DR., 5068 ODENTHAL, DE;MARTINY, GERD, DR.;STEINER, KARL-HEINZ, DIPL.-ING., 5000 KOELN, DE
分类号
C09B67/46;C09B67/54;(IPC1-7):C09B67/46
主分类号
C09B67/46
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Polymeric particles and processes for preparation of polymeric particles that involve molding
Method and compositions for the sealing and assembly of power train components
Ceramic composite
Binder for ink-jet printing ink, ink-jet printing ink containing the same, and printed matter
Method for producing semiconductor microparticles and the microparticles
Method for inducing UDP-glucuronosyltransferase activity using pterostilbene
Method of using omega-3 fatty acids
Solid forms of an antiviral compound
Inhibitors of protein kinases
Fused pyridine, pyrimidine and triazine compounds as cell cycle inhibitors
Sulphone-substituted quinazoline derivatives as immuno-modulators, their preparation and use as medicaments
Pyrrolidinone benzenesulfonamide derivatives as modulators of ion channels
Fulvene and fulvalene analogs and their use in treating cancers
P2X<sub>7</sub>: inhibition of epithelial cancers and papillomas
Natural gas engine lubricating oil compositions
Methods for producing active scFv antibodies and libraries therefor
Polishing agent, compound semiconductor manufacturing method, and semiconductor device manufacturing method
Method for manufacturing interposer
Method for forming coreless flip chip ball grid array (FCBGA) substrates and such substrates formed by the method
Co-integration of elemental semiconductor devices and compound semiconductor devices
