发明名称 ELECTROLESS PLATING METHOD
摘要 PURPOSE:To form easily, quickly and stably a uniform plating layer by subjecting a blank material to be plated to electroless plating while passing slight current via a plating liquid between the blank material and electrodes provided to face said material. CONSTITUTION:A work 13 to be plated is immersed by a lifting hook 14 into the electroless plating liquid 12 in a plating cell 11 and the electrodes 15, 16 provided in the liquid 12 to face the work 13 and the work 13 are connected by a conductor via power sources 17, 18 to constitute a closed circuit. The slight current is then passed through the liquid 12 between the work 13 and the electrodes 15, 16 by the above-mentioned power sources 17, 18, by which the electroless plating is executed. The above-mentioned slight current is adjusted to about the potential difference generated by the work 13 and the material constituting the electrodes 15, 16 by controlling the power sources 17, 18. The plating of the fine crystal is thus obtd.
申请公布号 JPS6134180(A) 申请公布日期 1986.02.18
申请号 JP19840156335 申请日期 1984.07.26
申请人 MITSUBISHI ELECTRIC CORP;DENKA HIMAKU KOGYO KK 发明人 SHIGA MASAAKI;AKIMOTO YASUNOBU
分类号 C23C18/54;C23C18/16 主分类号 C23C18/54
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