发明名称 COATING FORMING DEVICE
摘要 PURPOSE:To prevent deterioration in quality of coating due to peeling off of a deposit for coating and adhering to a work to be processed to form coating by providing a temperature controllable adhesion prevention board and an adhesion prevention unit using a mesh inside of a coating forming device such as a vacuum evaporating device etc. CONSTITUTION:Substance from an evaporation source 5 is stuck on the surface of a substrate 4 in a vacuum container by vaccum evaporation process, spatter process, CVD process etc. In this case evaporated substance from the evaporation source 5 adheres and accumulates on inner face of a container 3 and exfoliates and adheres on the surface of the substrate 4 and lowers the quality of coating on the face of the substrate. To prevent this, an adhesion prevention board 8 provided with a heater 10 and an adhesion prevension unit 7 made by attaching a mesh to the board are installed in the container 3. Excess evaporated substance from the evaporation source 5 is made to adhere on the adhesion prevention board 8 heated by the heater 10. Even when the adhered substance exfoliates, adhesion on the surface of the substrate 4 is prevented by the mesh 11, and deterioration in the quality of coating on the face of the substrate is prevented.
申请公布号 JPS6130661(A) 申请公布日期 1986.02.12
申请号 JP19840150003 申请日期 1984.07.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TANAKA KUNIO;IKEDA TANEJIRO
分类号 C23C14/22;C23C14/00;C23C14/56;C23C16/44;H01L21/203;H01L21/31 主分类号 C23C14/22
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