发明名称 BONDING METHOD OF TIPS OF THERMOPLASTIC RESIN FILMS
摘要 PURPOSE:To bond subject film without exposing an uncoated portion by forming a coating for surface modification, leaving uncoated portion at the tip in the width direction of a substrate film surface and by overlapping another film on the uncoated portion with a supersonic bonding and etc. CONSTITUTION:When the tip of a thermoplastic film (for example; soft polyvinyl chloride film etc.) is bonded, a coating 13 for a film surface modification is formed on one surface of a substrate film 11, leaving an uncoated portion 15 on one side alone in its width direction at the tip of the substrate film 11, and the reverse side of another film 12 is overlapped on the uncoated portion 15 of the film 11, and treated with a supersonic bonding or high-frequency bonding, resulting in the bonding of the tips of thermoplastic resin films.
申请公布号 JPS615922(A) 申请公布日期 1986.01.11
申请号 JP19840126195 申请日期 1984.06.19
申请人 MITSUBISHI KASEI BINIRU KK 发明人 NANUN KAZUYOSHI;OOHAYASHI ATSUSHI;ARAI HIROMI
分类号 B29C65/04;B29C65/00;B29C65/08 主分类号 B29C65/04
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