| 摘要 |
PURPOSE:To decrease generation of detachment and cracks by making a thickness of bonded layer uniform by employing the adhesive consisting of the resin that includes a filler material of predetermined size and has higher melting point than a room temperature for bonding an integrated circuit device to a tub. CONSTITUTION:The adhesive consisting of the heat-resistant resin that includes a filler material 211 and has higher melting point than a room temperature is used. For the filler material 211, particulate matters of the predetermined size, linear and fibrous materials of the predetermined thickness or fabric of the predetermined thickness are available. The adhesive 21 is put on a tub 22 and it is cured by heating under the condition that a semiconductor pellet 24 is pressed so as to bond the pellet 24 to the tub 22. A thickness of bonded layer is decided by size of the filler material 211. Then uniform thickness can be obtained and detachment and cracks of the bonded layer and cracks of the semiconductor pellet are decreased. |
