| 摘要 |
PURPOSE:To obtain the titled soln. easy to control and depositing stably metallic copper with remarkably improved strength and elongation by adding a surfactant having polyoxyethylene groups and the compound of a group IVB element to a chemical copper plating soln. CONSTITUTION:A polyoxyethylene surfactant and a compound of a group IVB element are added to a known chemical copper plating soln. contg. copper (II) ions, a copper (II) ion complexing agent, a copper (II) ion reducing agent and a copper ( I ) ion complexing agent. The polyoxyethylene surfactant added is the polyoxyethylene surfactant having alkyl ester, alkylamine or acetylene bonds or a polyoxyethylenepolyoxypropylene surfactant. The compound aded is dissolved in the alkaline plating soln. to produce oxyacid ions, and it is a compound of Si, Ge, Sn or Pb. Metallic copper deposited from the plating soln. shows >=about 50kg/mm.<2> strength and >=about 3% elongation at all times. |
