| 摘要 |
PURPOSE:To prevent occurrence of lead-open, etc. and to lower the height of the titled device by a method wherein a lead portion, which is disposed in a gelled state resin in a case, is formed nearly horizontally and is constituted so that said lead is projected on the surface of circumference of the case. CONSTITUTION:In said semiconductor device, a lead 13 in a case 2A is extended horizontally and is projecting out to the outside of the case penetrating through a circumference part of the case 2. In such a structure, if the gelled state resin 10 is expanded, a cover 12 is curved to upward, however, the lead 13 is not loaded with external force as the lead 13 is not fixed. As the case 12 is expanded outward in the radius direction by the expantion of the gelled state resin 10, the lead 13 which is one body with the circumference portion of the case 2A is applied with tensile force in the horizontal direction, too, however, only shearing force works onto soldered bonding surface, because all of the soldered bonding surface of the lead 13 facing to a terminal 6 and the other portion are levelled. |
