| 摘要 |
PURPOSE:To enable to measure alignment of a wafer in a short time by a method when objective precision of alignment is low, measurement of confirmation of the quantity of a slippage after a wafer is driven is omitted. CONSTITUTION:A CPU17 reads set data of an objective precision input device 18 at the step 402. Then alignment marks on a mask 1 and a wafer 2 are scanned according to a laser beam at the step 405, the fact that the acquired quantity of a slippage is in the range of objective precision or not is judged at the step 404, and when it is in the range thereof, the process is jumped at once to the step 407 to complete the alignment process. By driving the stage according to an open loop not to perform remeasurement when objective precision is low corresponding to objective precision like this, alignment can be attained at a high speed. |
