发明名称 FLUSSANTE E PROCEDIMENTO PER LA SALDATURA DOLCE DELL ALLUMINIO E DELLE SUE LEGHE
摘要 Soft solders, namely solder alloys melting at a temperature below about 350 DEG C., are generally preferred to the higher melting point hard solders and to the brazing and welding alloys for soldering a joint between a member made of aluminium or aluminium alloy and another member which may or may not be of aluminium or an aluminium alloy. However a disadvantage arising from this use of soft solders is that the corrosion resistance of such joints tends to be unsatisfactory. …<??>To deal with this problem, the invention provides a flux containing as one of the essential constituents thereof a silver halide which, when used in conjunction with a conventional lead/tin soft solder alloy, ensures that silver is deposited at the joint interface to prevent corrosion.
申请公布号 IT1108179(B) 申请公布日期 1985.12.02
申请号 IT19780069386 申请日期 1978.10.17
申请人 MULTICORE SOLDERS LTD 发明人
分类号 B23K35/363;B23K35/34;B23K35/36 主分类号 B23K35/363
代理机构 代理人
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