| 摘要 |
The present invention relates to a solder pad structure for increasing solder junction reliability of a semiconductor chip package. The solder pad structure comprises: a first solder pad which is formed at the lower portion of a semiconductor chip package; and a second solder pad which is provided to correspond to the first solder pad on one surface of a printed circuit board on which the semiconductor chip package is mounted, to join with solder, wherein the first solder pad is provided with a first junction portion protruding downwards to be convex in a dome shape and joins with the upper surface of the solder, and the second solder pad is provided with a second junction portion protruding upwards to be convex in a dome shape and joins with the lower surface of the solder. According to the present invention, a shape of an interface of the solder pad joining with the solder at the time of mounting a semiconductor chip package on a printed circuit board (PCB) adopts a protruding dome structure, stress generated between the solder and the pad by external heat, vibration, and impact is minimized to drastically improve reliability of electrical equipment. |
