| 摘要 |
A plating apparatus for automatic plating of objects to be plated such as IC lead frames in a plural number in considerably high speed as a whole process line in which plural number of aligned object to be plated in the form of strips is conveyed laterally at a time on the conveyed line which is formed with aligning rollers group and the feed rollers group, while conveying, the objects to be plated are carried out pre-treatment and after-treatment, between both of treatments, the plating treatment is carried out by injection of plating liquid to the objects to be plated, and as loading a vacuum apparatus moving with arc-shaped track is employed for transferring plural objects to be plated in one on a conveyor line. |
