| 摘要 |
PURPOSE:To take effective measures against thermal stress by a method wherein an insulating substrate such as ceramic substrate etc. is formed into one body while a stress concentrating part such as V type groove etc. is provided on the surface of insulating substrate to be classified into the section of heating part and others. CONSTITUTION:A V type groove 10 is provided so that a part whereon a heating part 3a contained in a hybrid integrated circuit constituted on an insulating substrate 1 formed into one body is loaded may be separated from another part whereon the other parts 3b are loaded. Through these procedures, when the heating part 3a is extremely heated in the operational status of a module to cause a stress on the substrate 1, the maximum stress is normally caused on a stress concentrating part such as the V type groove etc. to be broken at the beginning. And after the breakdown, the thermal resistance between the two substrates may be increased to reduce the thermal conductivity from heating part while increasing the temperature in heating part by diminishing the thermal unbalance in substrates divided into two parts to prevent the breakdown from happening. |
