发明名称 COMPACT DESIGN RELAY
摘要 In a compact design relay, in which gaps between a base member (2) and a case member (3) covering the base member and between the base member (2) and terminal pins (1) mounted on the base member are sealed by filing the gaps with an adhesive (4) which is thermally hardened thereafter, a small air vent hole (5) is formed in part of the case member (3) and/or base member (2) free from the adhesive (4) and is sealed with a further adhesive (8) after the thermal hardening treatment of the first-mentioned adhesive (4).
申请公布号 DE3172517(D1) 申请公布日期 1985.11.07
申请号 DE19813172517 申请日期 1981.07.09
申请人 IZUMI DENKI CORPORATION 发明人 TEIZO, FUJITA
分类号 H01H45/02;G06Q10/08;G06Q50/00;G06Q50/28;H01H50/02 主分类号 H01H45/02
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