| 摘要 |
PURPOSE:To accomplish the treatment of ICs in the absence of clean chamber by a method wherein the sealing doors of a first and second containes filled with static clean air are arranged to contact each other and an IC is caused to travel from a container to the other. CONSTITUTION:Before the opening of an interface 110, a container 90 is aligned to a rib 95 of a canopy 10 for a tight seal to be produced between the externals of doors 60 and 100 in touch with each other. The containers 90 and 10 are provided with apertures to filter dust so that there may be no difference in air pressure between the two containers and that the air therein may remain still. This eliminates the accumulation of dust on a wafer 82 housed in a cassette 80. A switch 180 is thrown in for the activation of latches belonging to the doors 60 and 100 and of an elevator 20. The cassette 80 after entering the canopy 10 is handled by a manipulator 30. The operating speed of a manipulator 130 fixed to an outer wall by means of a sealed type universal joint is controlled by a damper. An attached switch is operated to hold the cassette 80 at the end of an arm, rotatably around the vetical axis. With the apparatus being designed as such, an IC may be treated by means of a small-scale dustless apparatus without using a clean chamber.
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