| 摘要 |
<p>PURPOSE:To enable to easily perform inspection for a photo mask by a method wherein the pattern surface of the photo mask, which has been patterned on the reticle, is decomposed in the minimum pattern graphic in order to detect the surface defect of the pattern of the photo mask, which is used for a semiconductor device and when there exists a negative pattern surface less than this, the pattern is judged to be a defect. CONSTITUTION:A square negative pattern graphic of a prescribed dimension is digitized and the digitized graphic is made to input in a mask inspecting device. When the positive pattern of the mask surface of a mask having a pattern graphic is inspected, the inspection is performed by detecting the negative pattern graphic of the mask, which is smaller than the above-mentioned negative pattern graphic. Therefore, light, which is emitted from a lighting system 2, is irradiated on a reticle mask 1, which is a material to be inspected, from the lower direction of the reticle mask 1 and the pattern graphic of the mask 1, which has been patterned on the reticle mask 1, is read out by an optical system 3 over the surface of the mask 1 and the pattern graphic read out is converted into an optical signal by an image sensor 4. After that, this signal is sent to an image processor 8, to which a signal unit 9 incorporating prescribed square image signal therein has been connected, through a light-receiving signal 5, an AD coverter 6 a bit memory 7. The signal is compared with the square image signal in the image processor 8 and the result is made to display in a detecting circuit 10.</p> |
