| 摘要 |
<p>PURPOSE:To enable to make the titled substrate smaller in size by a method wherein a conductive pattern is provided on the lower layer of the conductive land on which a semiconductor chip will be mounted. CONSTITUTION:After the first conductor such as an Ag-Pd layer 12, for example, has been screen-printed and sintered on an aluminum-ceramic substrate 11 using a desired pattern, the first insulating layer 13 is printed and sintered. Subsequently, the second conductive layer such as Ag-Pd 14, for example, containing a semiconductor chip mounted land is printed and sintered on the pattern of the first conductive layer. Then, a resistor layer 15 with a desired pattern is printed and sintered. Lastly, a protective glass layer 16 is printed and sintered. As a result, the size of the thick film substrate can be made smaller in size, because the first conductive layer is present in the lower layer than the semiconductor chip mounted land, and the miniaturization of the hybrid integrated circuit can be accomplished.</p> |
