| 摘要 |
PURPOSE:To enable to securely prevent the generation of defective ICs to generate by being handled with a handling device made of metal without hindering the clear formation of marks to put on each IC by a method wherein the marking surface of the package of each IC is finished like a mirror surface, while the side surface opposite to the marking surface is formed in a roughened surface. CONSTITUTION:An IC 10 is one obtained by sealing an IC chip, wherein an LS- TTL has been formed, with a package 12 made of resin. Pin terminals 14 have been arrayed on both sides of this package 12 and the package 12 is assuming a so-called dual in-line type enclosing configuration. The package 12 is formed into a flat box type and the pin terminals 14 have been respectively arrayed on both side parts of the package 12. The upper side surface 18 of the package 12 is finished like a mirror surface, and moreover, marks 26, with which a type number and so forth are indicated, have been formed on the upper side surface 18 by performing directly a baking with laser beam, for example. On the other hand, a roughened surface 24 in a matted face been formed on the lower side surface 16 of the package 12. This roughened surface 24 can be formed with a very simple means of omitting partially the lapping of the molded surfaces of the metal molds, of which the package 12 has been molded. |
