| 摘要 |
PURPOSE:To enable to form an insulated and resin sealed semiconductor device into a completely insulated structure at the time of sealing with resin and to contrive to improve its insulating withstand voltage by a method wherein parts of the metal frame are fixed with the supporting frames molded of resin and the molding is performed. CONSTITUTION:The point parts of a metal frame 1 are fixed with supporting frames 10 molded of resin, and after that, the supporting frames 10 are fixed in such a way as to be tightly adhered with a top force 7 and a bottom force 8. Or, the supporting frames are held being inserted in the metal molds in advance, and after that, the metal frame 1 may be inserted in recessed parts, where have been formed in each part of the supporting frames 10, but the former is superior in workability. The supporting frames 10 do a working to ensure the parallelism of the back surface of the frame 1 and the bottom force 8. The supporting frames 10 are fixed in stepped parts provided at the point parts of the metal frame 1 at the time of sealing and external leads 21 are made to pressingly weld with the metal molds for preventing the position deviation of the metal frame 1. |
