| 摘要 |
PURPOSE:To improve the electric insulating property to eliminate displacement of a conductor pattern or the like at a press time by forming a window part for embossing work in a circuit board and using a plastic synthetic resin as a materials of an insulating substrate for the circuit board. CONSTITUTION:A front-side card substrate 2 and a rear-side card substrate 3 are arranged with a flexible substrate 1 in the center between them and are melt-fixed by heating and pressuring to constitute an IC card. The flexible substrate 1 in the center part consists of a non-thermoplastic resin such as polyimide, and a rectangular window part W for embossing work is provided along the longer side. A conductor pattern 1a is formed in a part other than the window part W on one face of the flexible substrate 1 by the etching method, a printing method, or the like. The front-side card substrate 2 and the rear-side card substrate 3 consist of a thermoplastic synthetic resin having the electric insulating property such as a vinyl chloride resin or the like. |
