| 摘要 |
PURPOSE:To improve the flatness of machining face by detecting the temperature distribution on the machining face of wafer and controlling the water temperature and the flow at the fluid supply port on the basis of comparison results between the detected temperature and the absolute setting temperature and between the detected temperature and the setting differential temperature. CONSTITUTION:A rotary surface plate 5 will rotate in the arrow direction to detect the temperature at the central portion (a) and the circumferential portions (b), (c) of wafer 2 through a temperature sensor 8 and to provide through a slipring 9 to a controller 12. The controller 12 will compare the detected temperature Tc and the detected differential tempearature Dc with the absolute setting temperature Ts and the setting differential temperature Ds, and if Dc> Ds and Tc>Ts, the cooling water temperature is lowered to increase the flow while if Dc<Ds an Tc<Ts, the water temperature is maintained to increase the flow and if Dc<Ds while Tc>Ts, the water temperature is lowered while if Dc<Ds and Tc<Ts, the water temperature is increased to maintain the flow thus to feed the cooling water 16 from a constant temperature water feeder 13 to the feeding hole 11 resulting in uniform temperature distribution on the machining face of wafer 2 and planar polishing. |
