| 摘要 |
<p>Disclosed are copolymers of alpha methylstyrene and para methylstyrene having Ring & Ball softening points greater than 140 DEG C, a Tg of greater than 100 DEG C to 110 DEG C, a weight average molecular weight (Mw) of less than 15,000, and a molecular weight distribution of about 2 to about 3. These copolymers are useful in adhesives, sealants and molding compounds, especially as reinforcing or modifier resins for thermoplastic block copolymers having aromatic and aliphatic blocks contained in pressure sensitive adhesives.</p> |
