发明名称 PLASMA TREATING DEVICE
摘要 PURPOSE:To perform the stabilization of treating characteristic and prevent the adverse influence of forming amorphous state by constructing to fall the effective area ratio of a cathode electrode to an anode electrode within the specific range, thereby obtaining stable bias voltage. CONSTITUTION:A reaction chamber 1 capable of holding a hermetical seal therein is supported so that a pair of parallel flat plate electrodes 2, 23 are opposed elevationally therein and supported. A susceptor 4 is secured to the electrode 2 of lower side, a silicon wafer W is loaded as a sample thereon, and an RF power source 6 is connected through a matching circuit 5 to the electrode 2. The electrode 3 of upside is connected together with the chamber 1 with an earth, with the result that the electrode 2 of lower side is used as a cathode electrode and the electrode 3 of upper side is used as an anode electrode. Further, the area of the cathode electrode (lower side electrode) 2 is increased larger than that of the anode electrode (upper side electrode), and set so that the ratio of the areas become the value of the range of 1-2. In this case, part of the inner surface of the chamber 1 may be performed as the function of the anode electrode, and the area of the anode electrode employs the effective area including these areas.
申请公布号 JPS60195939(A) 申请公布日期 1985.10.04
申请号 JP19840050997 申请日期 1984.03.19
申请人 HITACHI SEISAKUSHO KK;HITACHI MAIKURO COMPUTER ENGINEERING KK 发明人 HIROBE YOSHIMICHI;AZUMA HIDEAKI;NAKAJIMA SHIYUU
分类号 H01L21/302;H01L21/3065;(IPC1-7):H01L21/302 主分类号 H01L21/302
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