| 摘要 |
PURPOSE:To eliminate the mixture of atmospheric air and dusts and to improve the treating efficiency by providing a flow rate converter for increasing the supply amount of inert gas to a treating chamber in case of feeding and exhausting a wafer into and from the chamber larger than that at the heating time. CONSTITUTION:A gas supply hole 102 is provided in a treating chamber 101 for instantaneously annealing in the state that a wafer 201 placed on a wafer loader 202 is fed, and inert gas such as nitrogen gas 100 is fed. Two nitrogen gas passages are provided, a solenoid valve 110 is switched to become the passages passing a flowrate meter 111 and a reverse flow preventing valve 113 during heat treatment, and to become the passages passing the meter 112 and the valve 114 at the wafer feeding and exhausting times. A flowrate regulating valve attached to the meters 111, 112 is regulated so that the nitrogen gas flow rate at the wafer feeding and exhausting times increased larger than the nitrogen gas flow rate at the heating time. When the wafer 201 is disposed at the prescribed position and in the vicinity for annealing, the valve is switched to select the small flow rate, and when the displacement of the position is detected by a photosensor, the valve is switched to select the large flow rate. |
