| 摘要 |
Installation (10) for vacuum processing of substrates (12), including a vacuum module (14), in which processing under vacuum of said substrates (12) takes place, a pressure reduction module (16), including gate means (24), in which a pressure drop from atmospheric pressure down to vacuum takes place, and a pressure raise module (18), including gate means (76), in which a pressure increase upward from a vacuum to atmospheric pressure occurs. |
