| 摘要 |
PURPOSE:To enable both a power source conductor and an earthing conductor to be multi-connected to a plurality of ICs, by providing a solder on both the power source conductor and the earthing conductor which are provided for driving the ICs. CONSTITUTION:A heating element 15, a signal conductor 17, a common electrode 1, the power source conductor 10 and the earthing conductor 11 are provided on a substrate 13 through a glaze 14, and a protective layer 16 is provided on the heating element 15. Next, a solder is applied to the conductors 10, 11, and after reflowing, solder layers 12 are provided. Accordingly, since the cross-sectional areas of the conductors 10, 11 are greatly increased, multiple connection of the ICs 3 is enabled, connecting operation is facilitated, it is contrived to reduce the size of the thermal head, and a thermal head inexpensive and having high image quality can be obtained. |
